Application of thermal conductive materialsThe materials in this field mainly use the design scheme of gap to transfer heat, which can fill the gap, complete the heat transfer between the heating part and the cooling part, and also play the role of insulation, shock absorption, sealing, etc. It is required that the PET release film used has good temperature resistance, no local wrinkles, or there are bubbles and can not be torn off, die cutting edge warping and other phenomena.
Product model | Substrate thickness(μm) | Release force(gf/inch) | Remnant(%) | Thermal shrinkage(%) |
7752E7 | 50 | 500±100 | ≥80 | MD≤1.5,TD≤0.15 |