Release film of battery related adhesive productsThe PET release film used for products in this field shall have stable release force, high temperature and humidity resistance, and small climbing of the release force.
Product model | Substrate thickness（μm） | Release force（gf/inch） | Remnant（%） | Haze（%） | Light transmittance（%） |
CT1GH | 50 | 11±3 | ≥88 | ≤5 | ≥88 |
Die-cuttingDie cutting is a kind of material made into a certain shape after punching through a mold. PET release film used in this field needs to ensure stable release force, no missing coating, no dirt on the film surface, etc.
Product model | Substrate thickness（μm） | 20min离型力（gf/inch） | Remnant（%） |
5030 | 50/75/100 | 35±6 | ≥88 |
5040 | 50/75/100 | 45±8 | ≥88 |
Application of thermal conductive materialsThe materials in this field mainly use the design scheme of gap to transfer heat, which can fill the gap, complete the heat transfer between the heating part and the cooling part, and also play the role of insulation, shock absorption, sealing, etc. It is required that the PET release film used has good temperature resistance, no local wrinkles, or there are bubbles and can not be torn off, die cutting edge warping and other phenomena.
Product model | Substrate thickness（μm） | Release force（gf/inch） | Remnant（%） | Thermal shrinkage（%） |
7752E7 | 50 | 500±100 | ≥80 | MD≤1.5,TD≤0.15 |
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